Sourcing wire bonding machines from China
Semiconductor wire bonding machines and their parts carry 0% UK duty from China in the supplied tariff snapshot. New machines for Great Britain need machinery conformity assessment, appropriate marking and a declaration of conformity. Cambridge China Bridge sources semiconductor wire bonding machines.

Duty on wire bonding machines and parts
Heading 8486 covers semiconductor manufacturing machinery and its parts. Semiconductor wire bonding machines connect device pads to package terminals. The semiconductor device manufacturing line is relevant to complete bonders; the parts line covers qualifying parts and accessories. The table shows machine variants sharing a commodity line, rather than separate tariff subdivisions.
Read from the UK Trade Tariff on 25 October 2026, all supplied lines carried 0% duty for goods from China. The snapshot lists no anti-dumping or countervailing duties, suspensions or attached import controls. Import VAT is separate from customs duty.
Confirm the commodity code using the machine's function and the description of any separately imported parts. For wider heading context and a different bonding process, see the semiconductor wafer bonding machines guide.
| Goods | Commodity code | Duty | Anti-dumping or countervailing duty on China |
|---|---|---|---|
| Semiconductor ball wire bonding machines | 8486 20 00 00 | 0% | None |
| Parts and accessories for semiconductor wire bonding machines | 8486 90 00 00 | 0% | None |
Specify the wire, package and bonding process
Specify ball or wedge bonding, wire material and diameter, pad metallurgy, package dimensions, bond pitch and loop profile. Define the required handling method, heated workholder, vision alignment and recipe storage. Agree acceptance criteria for bond placement, pull strength and, for ball bonds, shear strength using your actual devices.
For new machinery supplied in Great Britain, the machinery safety rules require essential health and safety compliance, conformity assessment, a declaration of conformity and the relevant marking. Check the technical file arrangements, UKCA or CE marking and English instructions before shipment. Agree installation, software access, operator training and replacement tooling alongside the process specification.
Worked duty example
Illustrative example, not a quote: Illustrative order: 3 automatic semiconductor wire bonding machines under 8486 20 00 00, invoiced at £450,000 free on board, with £15,000 of freight and insurance to the UK. The customs value is £465,000. Duty at 0% is £0. Import VAT at 20% is charged on the customs value plus duty, £465,000, so it is £93,000. With no duty, the only import tax is the VAT, which a VAT-registered importer can usually reclaim. The import duty and VAT guide explains each step.
Inspection checklist
Bond trials: run your devices and wire through the agreed recipes; examine misplaced bonds, lifted bonds, damaged pads and loop consistency. Record the settings with the pull and shear results.
Tooling and handling: check capillaries or wedges, wire clamps, spool feed, workholders and package loading against the agreed supply list. Repeat the trial after a tooling change.
Safety and documents: match the machine identity to its declaration and instructions. Test guards, interlocks and emergency stops, and check access to hot surfaces and moving stages.
Arrival condition: inspect the crate and transit indicators, check the bonding head and stage alignment, then repeat the agreed trial after installation. Use the quality inspection guide to organise the checks.
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What goes wrong
A demonstration on the supplier's samples can hide problems with your pad finish, wire or package. Weak bonds, pad damage and inconsistent loops can appear when the same recipe is transferred to production. Accept the machine against recorded results on your materials, including repeat runs and tooling changes.
Transport can disturb alignment, while worn clamps or an unstable heated workholder can make results drift. Missing recipe access, tooling drawings or software permissions can delay recovery. Agree the arrival trial, recipe backup, spare tooling and support responsibilities before dispatch.
Cambridge China Bridge sources these products for UK businesses, checking the factory and the documents before shipment. See factory verification. For machinery and equipment, see machinery imports.
Frequently asked questions
What is the UK import duty on wire bonding machines from China?
The supplied tariff snapshot shows 0% duty for semiconductor manufacturing machines under 8486 20 00 00 and qualifying parts under 8486 90 00 00, with no listed trade remedies.
What safety documents should accompany a new wire bonder?
For Great Britain, check the declaration of conformity, UKCA or CE marking and English instructions. Also confirm the technical file arrangements and conformity assessment for the exact machine.
How should I test a wire bonding machine before shipment?
Use your own devices, wire and tooling. Record placement, loop shape, pull results and applicable ball shear results against agreed acceptance criteria.
Are wire bonding and wafer bonding machines interchangeable?
No. Wire bonders connect device pads to package terminals; wafer bonders join wafers. Specify the process and product before comparing machines.