Sourcing doped InP wafers from China

Duty on doped indium phosphide wafers

Heading 3818 covers chemical elements doped for electronics in disc, wafer or similar form, and chemical compounds doped for electronics. Doped indium phosphide wafers fall within the other compounds line, subject to confirmation of the actual goods. The supplied tariff file contains only this relevant line, so the table does not include unrelated silicon wafers.

Read from the UK Trade Tariff on 19 October 2026, code 3818 00 90 00 carries 0% duty for goods from China. The supplied record lists no anti-dumping or countervailing duty, suspension or attached import control for this line.

Give your broker the composition, dopant and processing state to confirm the commodity code. For the wider heading, see the doped gallium arsenide wafer guide.

Specify the dopant and wafer finish

Specify indium phosphide, the dopant identity, conductivity type, carrier concentration or resistivity range, and the measurement method. Agree crystal orientation, diameter, thickness, thickness variation, bow, warp and edge geometry. State whether the wafer is polished on the front surface or both surfaces, and agree surface defect acceptance criteria.

Ask for wafer identification and lot reports linked to the delivered material. Establish whether the supply is a substance or an article before deciding its UK REACH treatment. HSE defines an article by whether its shape, surface or design determines function more than its chemical composition. If supplied as a substance dangerous for supply, an up to date safety data sheet is required.

Worked duty example

Illustrative example, not a quote: Illustrative evaluation lot of doped indium phosphide wafers under 3818 00 90 00, invoiced at £3,000 free on board, with £200 of freight and insurance to the UK. The customs value is £3,200. Duty at 0% is £0. Import VAT at 20% is charged on the customs value plus duty, £3,200, so it is £640. With no duty, the only import tax is the VAT, which a VAT-registered importer can usually reclaim. The import duty and VAT guide explains each step.

Inspection checklist

Identity: match wafer and carrier identifiers to the packing list, dopant declaration and lot report.

Electrical properties: compare measured resistivity or carrier concentration with the ordered range, using the agreed method and sampling plan.

Geometry and surface: check thickness, bow, warp, orientation and polish against the specification; record cracks, edge chips, scratches and particles.

Packing: check carrier restraint, seals and wafer separation before unpacking; photograph damage and keep affected material separate.

What goes wrong

A wafer described only as doped indium phosphide can have the wrong dopant, electrical range or surface finish for the buyer's process. Unlinked lot reports make acceptance difficult. Poor restraint can cause chipped edges, while careless unpacking can scratch or contaminate polished surfaces.

Agree acceptance methods before ordering and compare an evaluation lot with the intended process. Obtain handling information before opening damaged packs or processing wafers. HSE says a safety data sheet is not a risk assessment; use it to inform your own assessment.

Cambridge China Bridge sources these products for UK businesses, checking the factory and the documents before shipment. See factory verification. For repeat volumes, see container programmes.